Gas supply device and apparatus for processing a substrate

ABSTRACT

A gas supply device may include a first gas supply member that may be disposed in a chamber and around a substrate loaded in the chamber. The first gas supply member may include nozzles for providing a gas onto the substrate. A second gas supply member that may provide the gas supplied from at least one gas supply line to the first gas supply member.

PRIORITY STATEMENT

This U.S. non-provisional application claims benefit of priority under35 U.S.C. § 119 from Korean Patent Application No. 2005-97979 filed onOct. 18, 2005 in the Korean Intellectual Property Office (KIPO), theentire contents of which are incorporated herein by reference.

BACKGROUND

1. Field

Example embodiments relate to a gas supply device and an apparatus forprocessing a substrate having the gas supply device, for example, a gassupply device for supplying a reaction gas onto a substrate.

2. Description of the Related Art

A semiconductor manufacturing process may include a fabrication process,an electrical die sorting (EDS) process and/or a packaging process.Integrated circuits including various elements may be formed on asilicon wafer in the fabrication process. Electrical characteristics ofthe integrated circuits may be inspected in the EDS process. Theintegrated circuits may be sealed and separated individually in thepackaging process.

The fabrication process may include a deposition process, aplanarization process, a photolithography process, an etching process,an ion implantation process, a cleaning process, and/or an inspectingprocess. A layer may be formed on a semiconductor substrate during thedeposition process. The layer may be patterned to form a desired patternon the substrate through the photolithography process and/or the etchingprocess. In the ion implantation process, impurities may be doped intopredetermined or desired portions of the substrate to form impurityregions. The cleaning process may remove products and particles from thedesired pattern and the substrate. The desired pattern and the substratemay be evaluated in the inspecting process.

A processing gas may be provided onto the substrate in the depositionprocess, for example, a chemical vapor deposition (CVD) process. Anetching gas may be introduced onto the substrate in the etching process,for example, a dry etching process. The processing gas and/or theetching gas may be uniformly provided onto the substrate to ensure adeposition uniformity and/or an etch uniformity of the layer. Theprocessing gas and/or etching gas may be introduced onto the substrateusing a shower-head-type gas supply device and/or an injector-type gassupply device.

Japanese Laid-Open Patent Publication No. 2000-263141 discloses asubstrate processing apparatus that may include an injector-type gassupply device. The injector-type gas supply device may provide aprocessing gas from a peripheral portion of a substrate to a centralportion of the substrate.

FIG. 1 is a cross-sectional view of a conventional gas supply device.

Referring to FIG. 1, a conventional injector-type gas supply device 20may include a gas member 22 and a plurality of nozzles 24. The gasmember 22 may be provided along a sidewall of the chamber 10 where asubstrate (not shown) may be processed. The gas member 22 may be coupledto a gas supply line (not shown) for introducing a processing gas intothe chamber 10. The nozzles 24 may be connected to the gas member 22 sothat the processing gas may be sprayed through the nozzles 24 onto asubstrate that may be loaded in the chamber 10.

The gas supply device 20 may include one gas supply line connected tothe gas member 22. The processing gas that may pass through the gassupply line and the gas member 22 may be sprayed through the nozzles 24onto the substrate in the chamber 10.

However, the processing gas may not be uniformly sprayed from thenozzles 24 onto the substrate. For example, the gas supply line may becoupled to only one side of the gas member 22. The amount of theprocessing gas that may be sprayed from one nozzle 24 adjacent to thegas supply line may be different from the amount of the processing gassprayed from the other nozzles 24 that may be located a distance awayfrom the gas supply line. If the amount of the processing gas sprayedfrom the nozzles 24 are different from one another, a uniformity of alayer that may be formed on the substrate may be deteriorated.Additionally, if an etching gas is provided from the nozzles 24, apattern that may be formed on the substrate by etching the layer mayhave a poor uniformity. For example, this problem may become moreserious if a semiconductor device has a minute design rule and/or if asemiconductor substrate has an increased size.

SUMMARY

Example embodiments may provide a gas supply device for more uniformlyproviding a gas onto a substrate.

Example embodiments may provide a substrate processing apparatus thatmay include a gas supply device capable of more uniformly providing agas onto a substrate.

In an example, non-limiting embodiment, a first gas supply member may bedisposed in a chamber and around a substrate loaded in the chamber. Thefirst gas supply member may include nozzles for providing a gas onto thesubstrate. A second gas supply member may be connected to the first gassupply member. The second gas supply member may provide the gas suppliedfrom at least one gas supply line to the first gas supply member.

According to an example, non-limiting embodiment, the second gas supplymember may be disposed within the first gas supply member, and thesecond gas supply member may have a plurality of openings to connect aninner cavity of the second gas supply member to an inner cavity of thefirst gas supply member. The plurality of openings and the at least onegas supply line may be alternately disposed, and the plurality ofopenings and the plurality of nozzles may be alternately disposed. Thenumber of the openings may be greater than the number of the gas supplylines.

According to an example, non-limiting embodiment, the first gas supplymember may be disposed within and may make contact with the second gassupply member. The second gas supply member may have a plurality ofopenings between the first gas supply member and the second gas supplymember to connect an inner cavity of the first gas supply member to aninner cavity of the second gas supply member. The plurality of openingsand the at least one gas supply line may be alternately disposed, andthe plurality of openings and the plurality of nozzles may bealternately disposed. The number of the openings may be greater than thenumber of the gas supply lines.

According to an example, non-limiting embodiment, the first gas supplymember may be disposed on the second gas supply member. A plurality ofopenings may be formed in the contact portion where the first gas supplymember and the second gas supply member make contact, and may connect aninner cavity of the second gas supply member to an inner cavity of thefirst gas supply member. The plurality of openings and the at least onegas supply line may be alternately disposed, and the plurality ofopenings and the plurality of nozzles may be alternately disposed. Thenumber of the openings may be greater than the number of the gas supplylines.

According to an example, non-limiting embodiment, the first gas supplymember may be spaced apart from the second gas supply member. The gassupply device may include a plurality of connection lines for connectingan inner cavity of the first gas supply member to an inner cavity of thesecond gas supply member. The plurality of connection lines and the atleast one gas supply line may be alternately disposed, and theconnection lines and the plurality of nozzles may be alternatelydisposed. The number of the connection lines may be greater than thenumber of the gas supply lines.

According to an example, non-limiting embodiment, the first gas supplymember and the second gas supply member may each be connected to adifferent gas reservoir.

According to an example, non-limiting embodiment, the gas supply devicemay further include a sealing member for sealing connections between theat least one gas supply line and the second gas supply member.

According to an example, non-limiting embodiment, the gas supply devicemay further include a frame disposed in the first gas member to supportthe second gas supply member, which may be separated from the first gassupply member by a predetermined distance.

According to an example, non-limiting embodiment, a substrate processingapparatus may include a chamber for receiving a substrate, a stagedisposed in the chamber to support the substrate, at least one gassupply unit, and a gas exhausting unit connected to the chamber toexhaust an unreacted gas and reaction by-products from the chamber.

According to an example, non-limiting embodiment, the second gas supplymember may be disposed within the first gas supply member, and thesecond gas supply member may have a plurality of openings to connect aninner cavity of the second gas supply member and an inner cavity of thesecond gas supply member.

According to an example, non-limiting embodiment, the substrateprocessing apparatus may further include a sealing member for sealing aconnection between the at least one gas supply line and the second gassupply member, and a frame disposed in the first gas supply member tosupport the second gas member which may be separated from the first gassupply member by a predetermined distance.

According to an example, non-limiting embodiment, the plurality ofopenings and the at least one gas supply line may be alternatelydisposed, and the plurality of openings and the plurality nozzles may bealternately disposed. The number of the openings may be greater than thenumber of the gas supply lines.

According to an example, non-limiting embodiment, the substrateprocessing apparatus may include a plurality of gas supply units stackedaround the substrate. The gas supply units may each provide differentgases onto the substrate.

BRIEF DESCRIPTION OF THE DRAWINGS

Example, non-limiting embodiments will be described with reference tothe accompanying drawings.

FIG. 1 is a cross-sectional view of a conventional gas supply device.

FIG. 2 is a cross-sectional view of a gas supply device in accordancewith an example, non-limiting embodiment.

FIG. 3 is an example cross-sectional view of the gas supply device ofFIG. 2, taken along a line III-III′.

FIG. 4 is an example perspective view of a second gas supply member ofthe gas supply device of FIG. 2.

FIG. 5 is a cross-sectional view of a gas supply device in accordancewith an example, non-limiting embodiment.

FIG. 6 is an example cross-sectional view of the gas supply device ofFIG. 5, taken along a line VI-VI′.

FIG. 7 is a cross-sectional view of a gas supply device in accordancewith an example, non-limiting embodiment.

FIG. 8 is an example cross-sectional view of the gas supply device ofFIG. 7, taken along a line VIII-VIII′.

FIG. 9 is a cross-sectional view of a gas supply device in accordancewith an example, non-limiting embodiment.

FIG. 10 is an example cross-sectional view of the gas supply device ofFIG. 9, taken along a line X-X′.

FIG. 11 is a cross-sectional view of a substrate processing apparatus inaccordance with an example, non-limiting embodiment.

FIG. 12 is an example cross-sectional view of the substrate processingapparatus of FIG. 11, taken along a line XII-XII′.

FIG. 13 is a plan view of a substrate processed using a conventional gassupply device.

FIG. 14 is a plan view of a substrate processed using a gas supplydevice in accordance with an example, non-limiting embodiment.

DESCRIPTION OF EXAMPLE NON-LIMITING EMBODIMENTS

Various example, non-limiting embodiments will now be described morefully with reference to the accompanying drawings. Example embodimentsmay, however, be in many different forms and should not be construed aslimited to the example embodiments set forth herein. Accordingly, theseexample, non-limiting embodiments are provided so that this disclosurewill be thorough and complete, and will fully convey the scope to thoseskilled in the art. In the drawings, the sizes and relative sizes of thefeatures and elements may be exaggerated for clarity.

It will be understood that when a feature or an element is referred toas being “on,” “connected to” or “coupled to” another feature orelement, it can be directly on, connected or coupled to the otherfeature or element or intervening features or elements that may bepresent. In contrast, when an element is referred to as being “directlyon,” “directly connected to” or “directly coupled to” another feature orelement, there are no intervening features or elements present. As usedherein, the term “and/or” includes any and all combinations of one ormore of the associated listed items.

It will be understood that, although the terms first, second, third etc.may be used herein to describe various elements, components, regions,layers and/or sections, these elements, components, regions, layersand/or sections should not be limited by these terms. These terms areonly used to distinguish one element, component, region, layer orsection from another region, layer or section. Thus, a first element,component, region, layer and/or section discussed below could be termeda second element, component, region, layer or section without departingfrom the teachings of the example embodiments.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper” and the like, may be used herein for ease of description todescribe one element or feature's relationship to another element(s) orfeature(s) as illustrated in the figures. It will be understood that thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. For example, when the device in thefigures is turned over, elements described as “below” or “beneath” otherelements or features would then be oriented “above” the other elementsor features. Thus, the example term “below” can encompass both anorientation of above and below. The device may be otherwise oriented(rotated 90 degrees or at other orientations) and the spatially relativedescriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the invention. Asused herein, the singular forms “a,” “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises”and/or “comprising,” when used in this specification, specify thepresence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components, and/or groups thereof.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this invention belongs. It will befurther understood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art andwill not be interpreted in an idealized or overly formal sense unlessexpressly so defined herein.

FIG. 2 is a cross-sectional view of a gas supply device in accordancewith an example, non-limiting embodiment. FIG. 3 is an examplecross-sectional view of the gas supply device of FIG. 2, taken along aline III-III′.

Referring to FIGS. 2 and 3, a gas supply device 100 may include a firstgas supply member 110 and a second gas supply member 120.

In an example, non-limiting embodiment, the first gas supply member 110may have a circular or substantially circular shape, for example, aring. By way of example only, the first gas supply member 110 may havean alternative shape, for example, square, rectangular, elliptical,arcuate, polygonal, etc.

In an example, non-limiting embodiment, the first gas supply member 110may have a cross-sectional shape that is circular or substantiallycircular, but is not limited thereto. By way of example only, the firstgas supply member 110 may have a cross-sectional shape that is circularwith a flattened edge, rectangular with rounded corners, elliptical,arcuate, polygonal, etc.

The first gas supply member 110 may be disposed in a chamber 10 that mayprovide a processing space where at least one substrate may beprocessed. The first gas supply member 110 may surround the processingspace of the chamber 10. For example, the first gas supply member 110may be integrally formed with the chamber 10, formed on a wall of thechamber 10, and/or embedded in a wall of the chamber 10. The first gassupply member 110 may be horizontally disposed with respect to thesubstrate loaded in the chamber 10.

The gas supply device 100 may include a stage 12 disposed in the chamber10 to horizontally support the substrate. A position of the first gassupply member 110 may be higher than the position of the substratesupported by the stage 12.

The gas supply device 100 may include a plurality of nozzles 112 thatmay be connected to the first gas supply member 110. Each of the nozzles112 may extend toward the substrate supported by the stage 12 in thechamber 10. The nozzles 112 may be uniformly spaced apart from oneanother.

In an example, non-limiting embodiment, the first gas supply member 110may be enclosed a sidewall of the chamber 10. For example, the first gassupply member 110 may be spaced apart from the sidewall of the chamber10 by a predetermined or desired distance. The nozzles 112 that may beconnected to the first gas supply member 110 may pass through the wallof the chamber 10 and may extend toward the substrate loaded in thechamber 10.

FIG. 4 is a perspective view of the second gas supply member 120 of FIG.2.

Referring to FIGS. 2 to 4, the second gas supply member 120 may bedisposed within the first gas supply member 110. The second gas supplymember 120 may have a diameter smaller than a diameter of the first gassupply member 110.

In an example, non-limiting embodiment, the second gas supply member 120may have a circular or substantially circular shape, for example, aring. By way of example only, the first gas supply member 110 may havean alternative shape, for example, square, rectangular, elliptical,arcuate, polygonal, etc.

In an example, non-limiting embodiment, the first gas supply member 110may have a cross-sectional shape that is circular or substantiallycircular, but is not limited thereto. By way of example only, the firstgas supply member 110 may have a cross-sectional shape that is circularwith a flattened edge, rectangular with rounded corners, elliptical,arcuate, polygonal, etc.

The second gas supply member 120 may have a plurality of openings 122that may connect an inner cavity of the first gas supply member 110 toan inner cavity of the second gas supply member 120. For example, theopenings 122 may allow the second gas supply member 120 to provide thegas to the first gas supply member 110. The openings 122 may beuniformly spaced apart from one another.

In an example, non-limiting embodiment, the openings 122 in the secondgas supply member 120 may be disposed radially in the same direction,along a wall of the second gas supply member 120. For example, theopenings 122 may be disposed at an upper facing portion, a lower facingportion, an inside facing portion or an outside facing portion of thesecond gas supply member 120, at intervals along the length of thesecond gas supply member 120. Alternatively, the openings 122 of thesecond gas supply member 120 may be disposed radially in differentdirections, along the wall second gas supply member 120, respectively.

In an example, non-limiting embodiment, the openings 122 and the nozzles112 may be alternately disposed so that a gas that may be supplied fromthe second gas supply member 120 to the first gas supply member 110 maynot be directly provided to the nozzles 112.

The gas supply device 100 may include a gas reservoir (not shown) and agas supply line 130. The gas supply line 130 may pass through the firstgas supply member 110 and may connect the gas reservoir to the secondgas supply member 120. The gas reservoir may provide the gas to thesecond gas supply member 120. For example, the gas may include aprocessing gas or a reaction gas.

The gas supply device 100 may include a sealing member 124 for sealingthe gas supply line 130 and the second gas supply member 120. Forexample, the sealing member 124 may prevent the leakage of the gas fromthe gas supply line 130 and the second gas supply member 120. Thesealing member 124 may be disposed where the gas supply line 130 and thesecond gas supply member 120 may connect.

The gas supply apparatus 100 may include a frame 126 that may bedisposed in the first gas supply member 110. The frame 126 may supportthe second gas supply member 120 disposed within the first gas supplymember 110 and separate the second gas supply member 120 from the firstgas supply member 110 at a predetermined or given distance. The frame126 may horizontally support the second gas supply member 120 in thefirst gas supply member 110 and may ensure horizontal positions of thesecond gas supply member 120 and first gas supply member 110 relative tothe substrate.

The openings 122 of the second gas supply member 120 may be alternatelydisposed with respect to where the gas supply line 130 and the secondgas supply member 120 may connect. For example, the gas supply line 130may be connected to a portion of the second gas supply member 120. Theopenings 122 may be positioned on the second gas supply member 120 awayfrom where the gas supply line 120 connects with the second gas supplymember 120. In this way, the gas in the second gas supply member 120supplied through the gas supply line 130 may not be directly provided tothe first gas supply member 110 through the openings 122. Instead, thegas may be more uniformly distributed in the second supply member 120when provided to the first gas supply member 110 through the openings122.

In an example, non-limiting embodiment, the gas supply device 100 mayinclude one gas supply line 130 and two openings 122. The two openings122 may be disposed across from each other centering the second gassupply member 120 by an angle of about 180°. The gas supply line 130 maybe connected to the second gas supply member 120 by an angle of about90° with respect to each of the openings 122.

In an example, non-limiting embodiment, the gas supply device 100 mayinclude a plurality of gas supply lines 130 connected to the second gassupply member 120. The gas supply lines 130 may be connected to one gasreservoir or a plurality of gas reservoirs, respectively. The number ofopenings 122 may be greater than the number of gas supply lines 130. Forexample, if the gas supply device 100 has a plurality of gas supplylines 130, the number of the openings 122 may be greater than that ofthe gas supply lines 130 so that the gas supplied through the gas supplylines 130 may be more uniformly provided to the first gas supply member110 through the openings 122. If the number of the openings 122 is thesame as that of the gas supply lines 130, the amount and the uniformityof the gas supplied through the gas supply lines 130 and the openings122 may not be improved. Accordingly, the number of the openings 122 maybe larger than that of the gas supply lines 130.

The gas supply device 100 may provide the gas onto the substrate in thechamber 10 through the nozzles 112. If the gas is more uniformlydistributed by the second gas supply member 120 and the first gas supplymember 110, and the gas may be more uniformly provided onto thesubstrate loaded in the chamber 10 so that the substrate may beuniformly processed by the gas.

FIG. 5 is a cross-sectional view of a gas supply device in accordancewith an example embodiment. FIG. 6 is a cross-sectional view of the gassupply device of FIG. 5, taken along a line VI-VI′.

Referring to FIGS. 5 and 6, the gas supply device 200 may include afirst gas supply member 210 and a second gas supply member 220. Thesecond gas supply member 220 may contact the first gas supply member210. The first gas supply member 210 may have constructionssubstantially the same as the construction of the first gas supplymember 110 described with reference to FIGS. 2 and 3. The second gassupply member 220 may have a circular or substantially circular shape,for example, a ring. By way of example only, the first gas supply membermay have an alternative shape, for example, square, rectangular,elliptical, arcuate, polygonal, etc.

In an example, non-limiting embodiment, the second gas supply member 220may have a cross-sectional shape that is circular or substantiallycircular, but is not limited thereto. By way of example only, the firstgas supply member 110 may have a cross-sectional shape that is circularwith a flattened edge, rectangular with rounded corners, elliptical,arcuate, polygonal, etc.

In an example, non-limiting embodiment, the second gas supply member 220may have a diameter substantially larger than the diameter of the firstgas supply member 210. For example, the first gas supply member 210 maybe disposed within the cavity of the second gas supply member 220 andmay contact with an inside wall of the second gas supply member 220.

In an example, non-limiting embodiment, the second gas supply member 220may have a diameter substantially smaller that the diameter of the firstgas supply member 210. For example, the second gas supply member 220 maybe disposed within the first gas supply member 210 and may make contactwith a wall of the second gas supply member 220.

In an example, non-limiting embodiment, the second gas supply member 220may have a diameter which may be the same as or substantially the sameas that of first gas supply member 210. For example, the second gassupply member 220 may be disposed on the first gas supply member 210 andan outside wall of the second gas supply member 220 may make contactwith an outside wall of the first gas supply member 210. By way ofexample only, the second gas supply member may be beneath, above, or tothe either side of first gas supply member 210.

A plurality of openings 222 may be formed between the first gas supplymember 210 and the second gas supply member 220. For example, theopenings 222 may connect the inner cavity of the first gas supply member210 to the inner cavity of the second gas supply member 220. Theopenings 222 may be spaced apart by a predetermined or given distance.

If the first gas supply member 210 is disposed within the second gassupply member 220, the openings 222 may be formed along a wall of thefirst gas supply member 210. If the second gas supply member 220 isdisposed within the first gas supply member 210, the openings 222 may beformed along a wall of the second gas supply member 220. If the firstgas supply member 210 is disposed on the second gas supply member, theopenings 222 may be formed in a connecting portion where the first gassupply member 210 and second gas supply member 220 may make contact.

In an example, non-limiting embodiment, the openings 222 and the nozzles212 may be alternately disposed. For example, the openings 222 may notdirectly communicate with the nozzles 212. In this way, a gas suppliedto the first gas supply member 210 through the openings 222 may not bedirectly provided to the nozzles 212. The first gas supply member 210may be disposed substantially parallel to the second gas supply member220. For example, the first gas supply member 210 and the second gassupply member 220 may be positioned on the same plane.

The gas supply device 200 may further include a gas reservoir (notshown) and a gas supply line 230. The gas supply line 230 may passthrough the first gas supply member 210 and may be connected to thesecond gas supply member 220. A sealing member (not shown) may be formedwhere the gas supply line 230 and the second gas supply member 220 mayconnect. For example, the sealing member may prevent the leakage of thegas from at the connection between the gas supply line 130 and thesecond gas supply member 220.

The openings 222 and the portion where the second gas supply member 220and the gas supply line 230 connect may be alternately disposed. Forexample, the gas supply line 230 may be connected to a portion of thesecond gas supply member 220 between the openings 222. In this way, thegas in the second gas supply member 220 that may be supplied through thegas supply line 230 may not be directly provided to the first gas supplymember 210 through the openings 222. The gas may be more uniformlydistributed in the second supply member 220 when provided to the firstgas supply member 220 through the openings 222.

In an example, non-limiting embodiment, a gas supply line 230 may beconnected to the second gas supply member 220. In an example,non-limiting embodiment, a plurality of gas supply lines 230 may becoupled to the second gas supply member 220. The plurality of gas supplylines 230 may be connected to one gas reservoir or a plurality of gasreservoirs (not shown), respectively.

If the gas supply device 200 includes a plurality of gas supply lines,the number of the openings 222 may be greater than the number of the gassupply lines. In this way, the gas supplied from the gas supply linesmay be more uniformly provided to the first gas supply member 210through the openings 222. If the number of the openings 230 issubstantially the same as that of the gas supply lines, the uniformityof the gas supplied from the gas supply lines may be somewhat reduced incomparison with the uniformity of the gas supplied from a gas supplydevice 200 that may have a greater number of openings 222 than gassupply lines.

The gas supply device 200 may provide the gas, for example, a processgas or a reaction gas onto the substrate through the nozzles 212. If thegas is more uniformly distributed through the second gas supply member220 and the first gas supply member 210, the gas may be more uniformlyprovided onto the substrate, and the substrate may be more uniformlyprocessed by the gas.

FIG. 7 is a cross-sectional view of a gas supply device in accordancewith an example, non-limiting embodiment. FIG. 8 is an examplecross-sectional view of the gas supply device of FIG. 7, taken along aline VIII-VIII′.

Referring to FIGS. 7 and 8, a gas supply device 300 may include a firstgas supply member 310 and a second gas supply member 320. The gas supplydevice 300 may have a construction substantially the same as that of thegas supply device 200 described with reference to FIGS. 5 and 6, exceptthat the first gas supply member 310 may be spaced apart from the secondgas supply member 320 and an inner cavity of the first gas supply member310 may be connected to an inner cavity of the second gas supply member320 through a plurality of connection lines 322, instead of through theopenings 222 as described with reference to FIGS. 5 and 6.

The gas supply device 300 may provide a gas, for example, a processinggas or a reaction gas, to the second gas supply member 320. The gas maybe distributed to the first gas supply member 210 through the connectionlines 322. The gas supply device 300 may provide the gas onto asubstrate through nozzles 312. The gas may be more uniformly distributedin the first gas supply member, and accordingly the gas supply device300 may more uniformly provide the gas onto a substrate and thesubstrate may be more uniformly processed by the gas.

FIG. 9 is a cross-sectional view of a gas supply device in accordancewith an example, non-limiting embodiment. FIG. 10 is an examplecross-sectional view of the gas supply device of FIG. 9, taken along aline X-X′.

Referring to FIGS. 9 and 10, a gas supply apparatus 400 may include afirst gas supply member 402 and a second gas supply member 404.

In an example, non-limiting embodiment, the first and the second gassupply members 402 and 404 may have constructions substantially the sameas those of the first and the second gas supply members 110 and 120described with reference to FIGS. 2 and 3.

In an example, non-limiting embodiment, the first and the second gassupply members 402 and 404 may have constructions substantially the sameas the first and the second gas supply members 210 and 220 describedwith reference to FIGS. 5 and 6 or constructions substantially the sameas the first and the second gas supply members 310 and 320 describedwith reference to FIGS. 7 and 8.

The first gas supply member 402 and the second gas supply member 404 maybe sequentially disposed in a sidewall of the chamber 10. The first andthe second gas supply member 402 and 404 may be connected to differentgas reservoirs, respectively. For example, a first gas may be providedinto a processing space of the chamber 10 through the first gas supplymember 402, and a second gas different from the first gas may beprovided into the processing space through the second gas supply member404. Alternately, for example, the first and the second gas supplymembers 402 and 404 may be coupled to one gas reservoir or may becoupled to two different gas reservoirs both containing the first gas.

A gas, for example, a process gas or a reaction gas, may be distributedthrough the first and the second gas supply members 402 and 404, the gassupply device 400 may provide the gas onto a substrate supported by astage 12. The gas may be more uniformly distributed through the firstand second gas supply members, and accordingly the gas may be moreuniformly provided onto the substrate and the uniformity of thesubstrate processed by the gas may be improved.

FIG. 11 is a cross-sectional view of a substrate processing apparatus inaccordance with an example, non-limiting embodiment. FIG. 12 is anexample cross-sectional view of the substrate processing apparatus ofFIG. 11, taken along a line XII-XII′.

Referring to FIGS. 11 and 12, a substrate processing apparatus 500 mayinclude a chamber 510, a stage 520, a gas supply device 530 and a gasexhausting unit 540.

The chamber 510 may provide a processing space for a substrate. Forexample, the chamber 510 may have a hollow cylindrical shape. Anentrance 512 may be provided at one side of the chamber 510 for loadingand unloading of the substrate. An outlet 514 may be formed through abottom of the chamber 510 to exhaust unreacted gas and reactionby-products from the chamber 510. The stage 520 may be disposed in thechamber 510. The stage 520 may horizontally support the substrate loadedin the chamber 510 for processing of the substrate.

The gas supply device 530 may provide a gas, for example, a processinggas or a reaction gas, onto the substrate. The gas supply device 530 mayhave a construction substantially the same as the construction of thegas supply device 100 described with reference to FIGS. 2 and 3.Alternatively, the gas supply device 530 may have a constructionsubstantially the same as the construction of the gas supply device 200described with reference to FIGS. 5 and 6 or the gas supply device 300described with reference to FIGS. 7 and 8.

In an example, non-limiting embodiment, the substrate processingapparatus 500 may include one gas supply device 530 or a plurality ofgas supply devices 530 that may be stacked around the substratesupported by the stage 520. Different gases may be provided from the gassupply devices onto the substrate.

The gas exhausting unit 540 may be coupled to the chamber 510. The gasexhausting unit 540 may exhaust reaction by-products and unreacted gasfrom the chamber 510. The gas exhausting unit 540 may include a vacuumpump 548, a vacuum line 542, a throttle valve 544 and a gate valve 546.

The vacuum pump 548 may maintain an inside of the chamber 510 in avacuum state and may exhaust the reaction by-products and the unreactedgas generated in the processing of the substrate from the chamber 510.For example, the processing of the substrate may include a depositionprocessing of forming a layer on the substrate or an etching processingof the layer formed the substrate.

The vacuum line 542 may connect the outlet 514 of the chamber 510 to thevacuum pump 548. The throttle valve 544 may be disposed in the vacuumline 542 and may adjust an internal pressure of the chamber 510. Thegate valve 546 may be opened and closed by the vacuum pump 548.

The substrate processing apparatus 500 may provide the gas through thegas supply device 530 onto the substrate supported by the stage 520. Thegas supply device 530 may more uniformly provide the gas to thesubstrate, and accordingly the substrate may be more uniformly processedby the gas.

FIG. 13 is a plan view of a substrate processed using conventional gassupply devices FIG. 14 is a plan view of a substrate processed using agas supply device in accordance with an example, non-limitingembodiment. In FIG. 13, the substrate was treated using a first gas anda second gas provided from two conventional gas supply devices. In FIG.14, the substrate was processed using a first gas and a second gassupplied from the gas supply device described with reference to FIGS. 9and 10. For example, the first gas and the second gas were an oxygen(O₂) gas and a silane (SiH₄) gas, respectively. A flow rate of the firstgas was about 100 sccm and a flow rate of the second gas was about 80sccm. The substrates having diameters of about 200 mm were processed inchambers having an internal pressure of about 5.0 mTorr. In FIGS. 13 and14, vertical axes indicate concentration ratios between the first andthe second gases on the substrates, respectively.

Referring to FIG. 13, a difference of the concentration ratios betweenthe first and the second gases was higher relative to portions of thesubstrate. For example, a portion of the substrate adjacent to gassupply lines of the conventional gas supply devices had concentrationratios between the first and the second gases considerably higher thanconcentration rations at other portions of the substrate spaced furtherapart from the gas supply lines. The uniformity of the concentrationratios between the first and the second gases on the substrate was about0.075 percent. If the difference of the concentration ratios between thefirst and the second gas (e.g., the oxygen gas and the silane gas) maybe higher, the substrate may not be uniformly processed by the first andthe second gases and a semiconductor device that may be formed on thesubstrate may have a poor reliability.

Referring to FIG. 14, a difference of the concentration ratios betweenthe first and the second gases was substantially lower with respect toportions of the substrate. The uniformity of the concentration ratiosbetween the first and the second gases on the substrate processed by agas supply device according to an example embodiment was about 0.041,which was greatly improved compared to the uniformity of theconcentration ratios on the substrate processed by the conventional gassupply device, which was about 0.075 percent. The flow rates of thefirst and the second gases provided from nozzles of the gas supplydevice were more uniform on the substrate irrespective of positions ofgas supply lines connected gas supply members in the gas supply device.For example, when the first and the second gases corresponded to theoxygen and the silane gases, the concentration ratios between the firstand the second gases met a desired value of about 1.25 (e.g., about 100sccm/80 sccm). In this way, the first and the second gases may be moredesirably mixed on the substrate irrespective of portions of thesubstrate. Accordingly, the substrate may be more uniformly processed bythe first and the second gases supplied form the gas supply device, anda semiconductor device may have an enhanced reliability, even though thesubstrate may have a large diameter and the semiconductor device mayhave minute dimensions.

Example, non-limiting embodiments may provide a gas supply device and/ora gas supply unit that may include a first gas supply member and asecond gas supply member. The second gas supply member may be connectedto the first gas supply member. The first gas supply member may includenozzles for spraying a gas onto a substrate horizontally disposed in achamber. The second gas supply member may provide the gas suppliedthrough supply lines to the first gas supply member. The gas may be moreuniformly distributed in the second gas supply member and also moreuniformly distributed in the first gas supply member. Accordingly, moreuniform gas may be provided onto a substrate from the gas supply deviceand/or the gas supply unit, and the substrate may be more uniformlyprocessed by the gas. As a result, a semiconductor device that may beformed on the substrate may have an enhanced reliability although thesubstrate may have a larger diameter and the semiconductor device mayhave minute dimensions.

The foregoing is illustrative of example, non-limiting embodiments andis not to be construed as limiting thereof. Although a few exampleembodiments have been described, those skilled in the art will readilyappreciate that many modifications are possible in the exampleembodiments without materially departing from the novel teachings andadvantages. Accordingly, all such modifications are intended to beincluded within the scope of the present invention as defined in theclaims.

1. A gas supply device comprising: a first gas supply member disposed ina chamber and around a substrate loaded in the chamber, the first gassupply member including nozzles for providing a gas onto the substrate;and a second gas supply member connected to the first gas supply member,the second gas supply member providing the gas supplied from at leastone gas supply line to the first gas supply member.
 2. The gas supplydevice of claim 1, wherein the second gas supply member is disposedwithin the first gas supply member, the second gas supply member havinga plurality of openings to connect an inner cavity of the second gassupply member to an inner cavity of the first gas supply member.
 3. Thegas supply device of claim 2, wherein the plurality of openings and theat least one gas supply line are alternately disposed, and the pluralityof openings and the plurality of the nozzles are alternately disposed.4. The gas supply device of claim 2, wherein the number of the openingsis greater than the number of the gas supply lines.
 5. The gas supplydevice of claim 1, wherein the first gas supply member is disposedwithin and makes contact with the second gas supply member, the secondgas supply member having a plurality of openings formed between thefirst gas supply member and the second gas supply member to connect aninner cavity of the second gas supply member to an inner cavity of thefirst gas supply member.
 6. The gas supply device of claim 5, whereinthe plurality of openings and the at least one gas supply line arealternately disposed, and the plurality of openings and the plurality ofthe nozzles are alternately disposed.
 7. The gas supply device of claim5, wherein the number of the openings is greater than the number of thegas supply lines.
 8. The gas supply device of claim 1, wherein the firstgas supply member is disposed on the second gas supply member, andwherein a plurality of openings may be formed in the contact portionwhere the first gas supply member and the second gas supply member makecontact, and to connect an inner cavity of the second gas supply memberto an inner cavity of the first gas supply member.
 9. The gas supplydevice of claim 8, wherein the plurality of openings and the gas supplylines are alternately disposed, and the plurality of openings and theplurality of the nozzles are alternately disposed.
 10. The gas supplydevice of claim 8, wherein the number of the openings is greater thanthe number of the gas supply lines.
 11. The gas supply device of claim1, wherein the first gas supply member is spaced apart from the secondgas supply member, and wherein the gas supply device includes aplurality of connection lines for connecting an inner cavity of thesecond gas supply member to an inner cavity of the first gas supplymember.
 12. The gas supply device of claim 11, wherein the connectionlines and the gas supply lines are alternately disposed, and theconnection lines and the plurality of the nozzles are alternatelydisposed.
 13. The gas supply device of claim 11, wherein the number ofthe connection lines is greater than the number of the gas supply lines.14. The gas supply device of claim 1, wherein the first gas supplymember and the second gas supply member are connected to different gasreservoirs.
 15. The gas supply device of claim 2, further comprising asealing member for sealing a connection between the at least one gassupply line and the second gas supply member.
 16. The gas supply deviceof claim 2, further comprising a frame disposed in the first gas memberto support the second gas supply member which is separated from thefirst gas supply member.
 17. A substrate processing apparatuscomprising: a chamber for receiving a substrate; a stage disposed in thechamber to support the substrate; at least one gas supply device ofclaim 1; and a gas exhausting unit connected to the chamber to exhaustan unreacted gas and reaction by-products from the chamber.
 18. Thesubstrate processing apparatus of claim 17, wherein the second gassupply member is disposed within the first gas supply member, andwherein the second gas supply member having a plurality of openings toconnect an inner cavity of the second gas supply member to an innercavity of the first gas supply member.
 19. The substrate processingapparatus of claim 18, further comprising: a sealing member for sealinga connection between the at least one gas supply line and the second gassupply member; and a frame disposed in the first gas supply member tosupport the second gas member which is separated from the first gassupply member by a predetermined distance.
 20. The substrate processingapparatus of claim 18, wherein the plurality of openings and the atleast one gas supply line are alternately disposed, and the plurality ofopenings and the plurality of the nozzles are alternately disposed. 21.The substrate processing apparatus of claim 18, wherein the number ofthe openings is greater than the number of the gas supply lines.
 22. Thesubstrate processing apparatus of claim 18, wherein the substrateprocessing apparatus comprises a plurality of gas supply units stackedaround the substrate.
 23. The substrate processing apparatus of claim22, wherein the gas supply units each provide different gases onto thesubstrate.